In semiconductor manufacturing, FPD production, and optics inspection applications, the demand for nanometer-level motion control continues to increase. For OEM machine builders, meeting these precision requirements while maintaining efficiency and throughput is a significant challenge. NanoPWM™ from ACS Motion Control offers a groundbreaking solution by combining the best of linear and PWM amplifier technologies, enabling next-generation motion systems to achieve unparalleled accuracy and performance.

What is NanoPWM™?

NanoPWM™ is a proprietary motion control technology that overcomes the traditional limitations of amplifiers. While linear amplifiers have been the go-to choice for high-precision applications, their low power efficiency makes them less suitable for modern large-format motion stages. NanoPWM™ bridges this gap, delivering the dynamic range and linearity of linear amplifiers with the efficiency and power capabilities of PWM amplifiers.

Key Benefits of NanoPWM™

• Nanometer-Scale Precision: Achieves sub-nanometer standstill jitter of +/- 0.3 nm and nanometer-level following error at constant velocity (+/- 10 nm at 100 mm/sec).
• Unmatched Dynamic Range: Provides an industry-leading current control dynamic range exceeding 100 dB.
• Versatility: Ideal for precision mechanical-bearing and air-bearing stages.
• Digital Control Technology: Ensures easy setup, high reliability, and superior performance.

Why NanoPWM™ is Essential for High-Precision Applications

As the latest generation of semiconductor and optics equipment incorporates larger and more powerful motion stages to meet increasing throughput demands, traditional solutions fall short. NanoPWM™ provides the precision required for nanometer-resolution applications while maintaining the efficiency and reliability necessary for modern industrial systems.

Perfect for Cutting-Edge Applications

NanoPWM™ is uniquely suited for industries and applications that demand ultra-precise motion control, including:

• Semiconductor Manufacturing: Supports the nanometer-scale accuracy required for wafer inspection and processing.
• Flat-Panel Display (FPD) Production: Enables precision in large-format screen manufacturing.
• Optics and Photonics: Delivers the stability needed for intricate optical inspections and assembly.

Redefine Motion Control Precision

NanoPWM™ is the answer for OEMs striving to push the boundaries of precision while meeting the demands of modern manufacturing. By combining exceptional accuracy, high dynamic range, and efficiency, this technology empowers machine builders to deliver high-performance solutions for nanometer-resolution applications.

Have you explored how NanoPWM™ can elevate your motion systems to the next level? With its cutting-edge features and unparalleled precision, NanoPWM™ ensures your equipment is ready for the challenges of tomorrow.

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Talk to one of our experts today at (855) 737-4716, or fill out our online form to learn more.

For high-tech OEM machine builders, precision and stability are non-negotiable when designing high-performance motion systems. Achieving sub-micron accuracy, fast settling times, and smooth constant velocity are critical to staying ahead in industries where throughput and precision intersect. ServoBoost™ from ACS Motion Control is a groundbreaking solution that leverages modern control theory and Servo Processor technology to exceed the limitations of traditional PID-based algorithms.

What Makes ServoBoost™ Different?

ServoBoost™ is an advanced servo control algorithm designed to automatically adapt to changing system conditions, compensating for disturbances, resonances, and other motion challenges. Its ability to dynamically adjust ensures unparalleled motion system performance across various demanding applications.

Key Benefits of ServoBoost™ Technology

• Enhanced Machine Performance: Faster settling, improved stability, lower jitter, and superior velocity regulation.
• Automatic Adaptation: Effortlessly adjusts to significant changes in load or system parameters.
• Disturbance Compensation: Mitigates issues such as resonances, axes interaction, cogging, and other motion disturbances.

Ideal Applications for ServoBoost™

ServoBoost™ is tailor-made for industries where precision and high throughput are essential. Some examples include:

• Precision Motion Stages: Perfect for linear motor and direct drive rotary systems.
• Point-to-Point Motion Applications: Addresses stringent move and settle targets as well as sub-micron to sub-nanometer standstill jitter.
• On-the-Fly Inspection Systems: Ensures smooth and accurate velocity regulation for demanding inspection processes.
• Systems with Unique Challenges: Optimized for weakly damped resonances, low stiffness, or large inertia mismatches.

Why ServoBoost™ is a Game-Changer

By combining real-time adaptability with advanced control algorithms, ServoBoost™ transforms the performance of motion systems. It helps OEMs overcome traditional motion control limitations, enabling faster, more precise, and more reliable machines. Whether you’re handling inspection, metrology, or high-speed manufacturing, ServoBoost™ equips your systems to excel in the most demanding environments.

Have you explored how ServoBoost™ can redefine motion system performance for your machines? With its unique combination of adaptability and precision, ServoBoost™ is the ultimate tool for achieving industry-leading motion control.

Relevant Products

• NPMpm

Talk to one of our experts today at (855) 737-4716, or fill out our online form to learn more. 

Bringing a complex machine to market is no small feat, especially when it involves multiple subsystems developed and tested by different teams, often in separate locations. For OEM machine builders, managing this complexity while accelerating time-to-market is critical. Flexible Configuration with ACS Motion Control is a powerful solution designed to simplify and streamline this process.

What is Flexible Configuration?

Flexible Configuration is a modular development tool that allows OEMs to define multiple subsystem combinations within a single master system configuration. This enables machine builders to develop, test, and integrate subsystems in parallel, facilitating a more efficient and collaborative development process.

Key Benefits of Flexible Configuration

• Accelerated Development Cycles: By enabling parallel development of machine subsystems, Flexible Configuration reduces the time needed to assemble and test the final machine.
• Simplified Integration: Teams working in different locations or on distinct subsystems can collaborate seamlessly within a unified master system configuration.
• Increased Modularity: Machine builders can define flexible subsystem combinations, supporting customization and scalability for various applications.
• Reduced Time-to-Market: The streamlined development process helps OEMs launch their machines faster, gaining a competitive edge.

Applications for Flexible Configuration

Flexible Configuration is particularly advantageous for OEMs building complex machines that require seamless integration of multiple subsystems, such as:

• Industrial Automation Systems: Coordinate diverse subsystems like motion control, vision systems, and safety controls with ease.
• Packaging Equipment: Enable modular development for various packaging formats and requirements.
• Medical Devices: Simplify the integration of intricate components in diagnostic or treatment machines.
• Robotics Solutions: Develop and test robotic subsystems in parallel to accelerate deployment.

Why Flexible Configuration Matters

Flexible Configuration offers OEMs a practical solution to overcome the challenges of complex machine development. By reducing time and effort, this tool not only simplifies the development process but also improves collaboration and scalability for future projects.

Have you considered how Flexible Configuration can transform your machine-building process? With its ability to streamline subsystem integration and accelerate development cycles, Flexible Configuration provides the tools you need to bring complex machines to market faster and more efficiently.

Relevant Products

• SPiiPlusES

Talk to one of our experts today at (855) 737-4716, or fill out our online form to learn more. 

The Simplicity of Airless Design

Traditional vacuum systems rely on extensive air piping, compressors, and solenoid valves, which can complicate installation and maintenance. Airless vacuum pumps eliminate these requirements, providing a streamlined solution that connects directly to your power source. This innovation not only reduces setup times but also minimizes the space needed for operation, making it ideal for constrained industrial environments.

Compact and Functional

Imagine a palm-sized device capable of performing essential pick-and-place operations with precision and reliability. Airless vacuum systems integrate critical features such as solenoid valves and pressure sensors directly into the unit, ensuring functionality without the bulk of traditional systems. Built-in displays and user-friendly interfaces allow operators to adjust settings and monitor performance with ease, making operations smoother and more efficient.

Environmentally Conscious Engineering

Switching to airless vacuum technology is not just about efficiency—it’s also a step toward sustainability. By eliminating the need for air compressors, these systems significantly reduce energy consumption and operational waste, contributing to greener, more cost-effective manufacturing processes.

A Smarter Choice for the Future

If you’re ready to simplify your automation setup and embrace cutting-edge technology, consider the benefits of airless vacuum systems. They represent a shift in how industries approach lightweight applications, offering compact, efficient, and eco-friendly solutions for modern challenges.

Discover how this technology can transform your operations by reaching out to Valin Corporation. Our automation specialists are here to help you implement solutions that improve productivity and reduce costs, all while supporting sustainability goals.

Talk to one of our experts today at (855) 737-4716, or fill out our online form to learn more. 

Below is a graphic showing the various processes in semiconductor manufacturing. In this blog we will explain each process and show you retrofit solutions that are currently available to help you make your process more efficient.

Ion Implant

The Ion Implantation process is a critical step in semiconductor manufacturing. It involves the precise introduction of ions, typically of specific elements, into a semiconductor wafer to alter its electrical properties. This controlled ion bombardment allows for the creation of n-type and p-type regions, which are essential for the formation of transistors and other semiconductor devices. By customizing the ion type, energy, and dosage, manufacturers can precisely tailor the electrical characteristics of the semiconductor material, enabling the production of high-performance integrated circuits used in various electronic devices, from smartphones to computers and beyond. Ion implantation plays a pivotal role in ensuring the functionality and efficiency of modern semiconductor components.

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Diffusion

The Diffusion process is a fundamental technique used in semiconductor manufacturing to introduce specific dopant atoms into a silicon wafer. During diffusion, the wafer is exposed to a controlled atmosphere at high temperatures, allowing the dopant atoms to penetrate the silicon's crystal lattice. This alters the electrical properties of the material, creating regions with distinct conductivity characteristics. By carefully controlling time, temperature, and the choice of dopant materials, semiconductor manufacturers can precisely engineer the electrical properties of the silicon, enabling the creation of components like diodes, transistors, and other integrated circuit elements. The Diffusion process is integral to the construction of semiconductor devices that power a wide range of electronic products we use daily.

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Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization (CMP) is a vital manufacturing process used to create a flat, uniform surface across a silicon wafer. In CMP, a combination of chemical solutions and mechanical abrasion is applied to remove irregularities and imperfections from the wafer's surface. This process is crucial for achieving the precise layering of materials and the formation of multi-layered integrated circuits. By carefully adjusting the chemical slurry, pressure, and abrasion, CMP ensures that the wafer's surface is perfectly planar, which is essential for the successful patterning and etching of intricate circuitry. CMP plays a pivotal role in enhancing the performance and reliability of semiconductor devices in the microelectronics industry.

Learn about our Chemical Mechanical Planarization Retrofit Solutions.
 

Deposition

The Deposition process is a fundamental step in semiconductor manufacturing, primarily used to add thin films of various materials to a silicon wafer. These films may consist of conductive, insulating, or semiconductive materials, depending on the specific requirements of the semiconductor device being fabricated. This process can be accomplished through various techniques, including chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD). Deposition is critical for building the intricate layers of transistors, interconnects, and other components on a semiconductor wafer, allowing for the creation of integrated circuits with precise electrical properties and functionality. Deposition is a cornerstone of semiconductor technology, facilitating the production of advanced electronic devices that power our modern world.

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Photoresist Coating

Photolithography is a cornerstone of semiconductor manufacturing, facilitating the precise patterning and definition of integrated circuits on silicon wafers. Photoresist coating is the first step. In this intricate process, a light-sensitive photoresist material is applied uniformly to the wafer's surface. Subsequent exposure, development, and etching steps remove material according to the pattern, leaving behind the desired circuit features. Photolithography is fundamental to the miniaturization of semiconductor devices, allowing for components to be more complex while still decreasing in size, including transistors and interconnects, which are integral to the performance and capabilities of modern electronics.

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Exposure

The Exposure process is the next critical step in photolithography. During exposure, a photomask, which contains the desired circuit pattern, is precisely aligned with a light-sensitive photoresist-coated wafer. Ultraviolet light or other suitable wavelengths are used to project the pattern onto the photoresist. This exposure chemically alters the photoresist, making it either more or less soluble in a subsequent development step. The result is a detailed replica of the photomask pattern on the wafer's surface, allowing for the selective removal of material and the creation of the intricate structures and features needed for semiconductor devices. Exposure is a crucial process in semiconductor manufacturing, enabling the fine customization of circuitry and the miniaturization of electronic components.

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Developing

The Developing process is a pivotal step in photolithography, a fundamental technique used in semiconductor manufacturing. Following exposure to a patterned light source, a light-sensitive photoresist-coated semiconductor wafer undergoes development. During this step, the exposed or unexposed areas of the photoresist are selectively removed by a chemical developer solution. This reveals the desired pattern on the wafer's surface, mirroring the circuitry or features defined by the photomask. The development process is a critical element in creating the precise structures and patterns needed for semiconductor devices, enabling the miniaturization and complexity that characterize modern electronic components.

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Etching

The Etching process is a crucial step in semiconductor fabrication, used to selectively remove specific material layers from a semiconductor wafer. This process is essential for defining the intricate patterns and circuitry required for semiconductor devices. Two common etching methods include wet etching, which involves the use of chemical solutions to dissolve unwanted materials, and dry etching, where plasma or reactive gases are used to remove material through chemical reactions or physical sputtering. By precisely controlling the etching process, manufacturers can create the fine features and structures needed for transistors, interconnects, and other elements on the silicon wafer. Etching is an indispensable technique for customizing the design and functionality of semiconductor devices in the electronics industry.

Learn about our Etching Retrofit Solutions.
 

Video: Valin's Pneumatic EV Manifold Retrofit Solutions

Case Study: Semifab Reduces Wafer Scrap with Pneumatic EV Manifold Retrofit Kits

Case Study: Semi Fab Eliminates Air Leaks with Easy to Install Manifold Retrofit Kits

Article: Improving Yield through Upgraded Pneumatic EV Manifolds

Press Release: Valin Corporation Customers See Success with Pneumatic EV Manifold Retrofit Kits

Blog: Wafer Yield in the Semiconductor Industry

Contact our team of semiconductor technical specialists at (855) 737-4716 or email our team at manifold@valin.com to learn more.

In industries where speed and precision are essential, every millisecond matters. For demanding point-to-point motion applications, such as semiconductor inspection and flat-panel display (FPD) metrology, achieving faster, more accurate results can make all the difference. Advanced algorithms like MotionBoost™ from ACS Motion Control offer a solution by optimizing motion profiles to enhance performance.

What Makes MotionBoost™ Essential?

MotionBoost™ is a cutting-edge motion profiling algorithm designed to streamline operations in precision applications. By minimizing the energy injected into the motion stage, it reduces vibration and settling times, enabling faster, smoother, and more efficient movements. This technology transforms how high-throughput systems handle complex motions.

Benefits of MotionBoost™ Technology

• Faster Settling Times: Reduces vibrations to stabilize positioning more quickly after each movement.
• Increased Throughput: Saves milliseconds per motion cycle, dramatically increasing productivity over thousands of cycles.
• Enhanced Precision: Delivers smoother motion, ensuring accurate static measurements in high-resolution applications.
• Energy Optimization: Lowers unnecessary energy use, leading to cost savings and prolonged system life.

Applications That Demand Speed and Precision

MotionBoost™ excels in industries where performance depends on fast, accurate motion:

• Semiconductor Metrology: Facilitates faster wafer inspections with reliable results.
• Flat-Panel Display Manufacturing: Enhances throughput by optimizing high-speed measurement processes.
• Precision Manufacturing: Ensures accurate positioning for rapid, repetitive tasks.

How MotionBoost™ Makes a Difference

With its ability to optimize motion profiles, MotionBoost™ is more than a technological enhancement—it’s a game-changer for industries where throughput, efficiency, and precision define success. By eliminating unnecessary delays and reducing vibrations, it enables faster operations without compromising accuracy, helping businesses achieve their goals faster and more effectively.

Have you considered how advanced motion profiles like MotionBoost™ can revolutionize your operations? Discover how this innovative solution can help you meet the demands of high-speed, high-precision applications while improving efficiency and reducing costs.

Relevant Products

• SPiiPlusES

Talk to one of our experts today at (855) 737-4716, or fill out our online form to learn more. 

Ensure machine safety, security, and operational uptime with advanced network technology. NetworkBoost™ from ACS Motion Control

NetworkBoost™ from ACS Motion Control provides EtherCAT network cable failure detection and recovery to maximize machine efficiency. Utilizing a robust ring network topology, this system pinpoints the exact location of a cable failure, allowing operations to continue seamlessly while awaiting repairs. This minimizes downtime and ensures uninterrupted production.

Key Features of NetworkBoost™

• Improved Uptime: Quickly detect and recover from cable failures, keeping operations running smoothly.
• Accurate Diagnostics: Pinpoint the precise location of cable issues for faster maintenance.
• Optimized for Moving Applications: Perfect for dynamic systems like pick-and-place machines with moving carriages.

NetworkBoost™ delivers the reliability needed to reduce downtime and enhance operational efficiency. Reach out to learn more about integrating this innovative solution into your automation systems.

Relevant Products

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Talk to one of our experts today at (855) 737-4716, or fill out our online form to learn more.