Watlow’s layered heaters provide the precision and flexibility needed to ensure the highest level of thermal performance in wafer processing applications. These planar heating circuits can be manufactured using various technologies, including thermal spray, thick film and thin film deposition, wet etching, and laser ablation. They are designed with distributed power circuitry and can accommodate multiple zones and multiple layers. Watlow has a wide range of integration capabilities that are compatible with various metal and ceramic substrates, depending on the application needs.
Watlow provides precision elastomeric bonding and assembly integration capabilities for critical components in wafer processing tools. Specialized tooling and innovative bond methods enable superior control over dimensional characteristics and material properties. Watlow also applies elastomeric material expertise to custom molding solutions, both for assembly integration and as stand-alone coatings, seals, and gaskets.
Features
Layered Heaters / Precision Bonded Assembly Features
Layered Heater Features
- Accommodate multiple zones and multiple layers
- Enable customized resistance patterns designed with FEA/CFD
- Provide high power densities (typ. 50 – 150 W/in2)
- Offer low profile (microns to 0.5 mm)
Precision Bonded Assembly Features
- Ensure flexibility with multiple substrate materials
- Enable elastomer temperatures to 250°C
- Provide custom thermal and mechanical properties (thermal conductivity 0.1 to 3.0 W/m-K)
Specifications
Layered Heater / Precision Bonded Assembly Specifications
| Substrate Material Maximum | Temperature |
| Austenitic stainless steel | 250°C |
| Ferritic stainless steel | 450°C |
| Titanium / molybdenum | 500°C |
| Aluminum | 250°C |
| Aluminum oxide | 500°C |
| Aluminum nitride | 600°C |
| Quartz / sapphire | 350°C |
Q & A
Layered Heater / Precision Bonded Assembly Q & A
Downloads
Download Watlow Thermal Solutions for the Semiconductor Equipment Industry Brochure
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